flow solder method 滚动焊剂法
The higher the temperature is, the bigger the stirring flow of the solder surface is, the more the scum there will be.
温度越高及焊锡表面的搅流越大，形成的浮渣越多。
The material used for solder pot, particularly for the part with a tight contact with flow solder, should avoid direct use of stainless steel.
锡炉材料特别是与流动钎料接触比较紧密的部分应尽量避免直接使用不锈钢材料。
Solder alloys are selected for their properties to flow, sealing ability, electrical conductivity, and for general body work to provide a smooth surface for finishing.
选择软焊合金时应考虑其流动性、密封能力和导电性，此外？以提供光滑的加工表面。
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