Therefore, electroplating of lead-free solder coating is one of investigation hotspots in electronic electroplating field.
因此，电沉积无铅可焊性镀层是电子电镀领域的研究热点之一。
Soldering on ADI surface decreased the ADI tensile strength and elongation, and solder coating could not prevent from water embrittlement.
试样表面镀锡使ADI的抗拉强度和伸长率下降，镀锡层不能有效防止ADI的水脆化。
In addition, the solder mask coating on printed circuit board, with the plasma treatment, can also obtain certain roughness and high active surface, thus improving the solder coating adhesion.
另外，在阻焊膜涂覆前，用等离子体对印制电路板面处理一下，还可获得一定的粗糙度和高活性的表面，从而提高阻焊膜层的附着力。
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