Therefore, electroplating of lead-free solder coating is one of investigation hotspots in electronic electroplating field.

因此，电沉积无铅可焊性镀层是电子电镀领域的研究热点之一。

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Soldering on ADI surface decreased the ADI tensile strength and elongation, and solder coating could not prevent from water embrittlement.

试样表面镀锡使ADI的抗拉强度和伸长率下降，镀锡层不能有效防止ADI的水脆化。

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In addition, the solder mask coating on printed circuit board, with the plasma treatment, can also obtain certain roughness and high active surface, thus improving the solder coating adhesion.

另外，在阻焊膜涂覆前，用等离子体对印制电路板面处理一下，还可获得一定的粗糙度和高活性的表面，从而提高阻焊膜层的附着力。

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