...ld bump 金凸块制程,gold bump,solder bumping[网路当红],flip chip,可分为金凸块（Gold bumping）及锡铅凸块（Solder bumping），利用薄膜制程 …
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We particularly expatiated some key technology about CSP: structure designing technology, Solder Bumping making technology, envelopment technology, testing technology.
详细阐述了CSP的几项主要的关键技术：即结构设计技术，凸点制作技术，包封技术和测试技术。
Laser bumping is advantageous for its flexibility especially when used for individual solder ball rework and small or medium production of BGA packages, yet it hasn't been vastly applied presently.
激光植球的优势在于它的柔性，它适宜于中小批量BGA的生产与个别焊球的修复，不过目前还没有投入大规模的应用。
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