A silver solder, placed between the segment and the core, is heated above the melting point to bond the segment to the core.

银焊料、设置之间的核心部分，加热至熔点以上的债券为核心的部分。

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There is only a small influence of the bond frame width of glass solder on the thermal stress.

玻璃焊料线宽对热应力影响不大，厚度和键合温度越大热应力越大。

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Then, the solder is reflowed to bond the first and second posts, and the mother device wafer is diced.

接着，使所述焊料回流以接合所述多个第一柱和所 述多个第二柱，并且切割所述母器件晶片。

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