... 导线未焊(Conductor not solder) 锡球(Solder Balls) 桥接(Bridge) ...
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The stress is the direct cause to lead to solder balls failure, which causes microelectronic devices damage.
应力是导致焊球失效的直接原因，进而致使器件失效。
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This circuitry will allow the microprocessor maker to replace the delicate bonding wires connecting the chip to the package with tiny balls of solder.
FORBES: It's all in the packaging
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