以上来源于: WordNet
The paper presents the comparison of printed circuit board solder ability test results measured before and after cleaning.
本文比较了印刷电路板在清洗表面之前和之后的焊接能力测量结果。
Solder alloys are selected for their properties to flow, sealing ability, electrical conductivity, and for general body work to provide a smooth surface for finishing.
选择软焊合金时应考虑其流动性、密封能力和导电性，此外？以提供光滑的加工表面。
It introduced drawing, punching progressive dies for solder pieces and analyzed the processing ability of the component for stamping and punching. The structure of the die was designed reasonably.
介绍了焊片零件拉伸、冲裁多工位级进模，分析了零件的冲压工艺性，并对模具结构进行了合理的设计。
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