The second technique involved using braided solder wick and a soldering iron with a blade tip to remove residual solder from the PCB pad.
第二个技术工艺涉及到使用网状焊料芯吸法及有刀片尖的焊接烙铁来除去PC B焊盘上的残余焊料。
Remove the solder so that there is no contact between the diodes.
除去焊锡，使得两个二极管不接触。
Remove excess solder with small brush while plastic leaving a fillet around end of valve as it cools.
当焊料处于粘滞状态时，用刷子把多余的焊料清除干净。焊料冷却后，将一条嵌条环绕在阀门的端口。
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