This wafer level chip size package (WL-CSP) process encases the die in a solid die-size glass shell.
圆片级芯片尺寸封装(WL-CSP)工艺是在固态芯片尺寸玻璃外壳中装入芯片。
Propose the same size package your current employer has promised you if you were to be dismissed, she advises.
她建议,可以向潜在雇主提出,如果你被解雇,应该获得和现在雇主承诺的相同的补偿。
Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor.
半导体器件,半导体晶片,芯片尺寸封装及制作和检测方法。
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