Single wafer processes use higher pressures than the batch processes.
单片工艺比多片工艺要用较高的压力。
It takes around 13 cubic metres of freshwater to produce a single 200mm semiconductor wafer, for example.
例如，制造出一块2分米长的半导体晶片需消耗13立方米的水。
Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.
阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。
应用推荐