Failure analysis is conducted for the single chip packaging process of an advanced high-range MEMS accelerometer with double cantilever beams.
对一种先进的双悬臂梁高量程MEMS加速度计的单芯片封装工艺进行了失效机理分析。
This paper discusses the possibility of the method of stability analysis of the rock slope with the wedge failure and intersected by a single fault and joints.
本文探讨存在单一断层斜切岩石边坡时，断层与追踪破裂面所形成的三维块体的稳定性分析方法。
The model of failure distribution is not the single one, so the optimum distribution model is determined by applying method of chart analysis and error area ratio.
针对故障分布模型不唯一这一特点，本文提出采用图分析和误差面积比指数从定性和定量两方面确定其最优分布模型。
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