Failure analysis is conducted for the single chip packaging process of an advanced high-range MEMS accelerometer with double cantilever beams.
对一种先进的双悬臂梁高量程MEMS加速度计的单芯片封装工艺进行了失效机理分析。
Instead, extra oomph has been added in recent years by packaging multiple processing engines, or "cores", inside a single chip.
与之相反的是，近年来出现的通过将多个处理引擎或者“核”封装在一个芯片上的现象，又展现了另一种魅力。
Mask line Machining made of non-woven using high-quality, single and multi-chip packaging, and customers can request for sterilization.
面膜系采用优质无纺布加工制成，有单片和多片包装，并可按客户要求作灭菌处理。
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