Making method of high deep-width rate, batch production of planar windings with LIGA process and silicon deep etching process is researched in the thesis.
较深入地研究了以LIGA工艺、硅深刻蚀工艺为主的平面绕阻的高深宽比、批量化制作方法。
参考来源 - 基于微机械工艺的电磁型平面微电机的研究·2,447,543篇论文数据，部分数据来源于NoteExpress
Making method of high deep-width rate, batch production of planar windings with LIGA process and silicon deep etching process is researched .
较深入地研究了以LIGA工艺、硅深刻蚀工艺为主的平面绕阻的高深宽比、批量化制作方法。
A tunneling accelerometer is fabricated and characterized based on the extension of the silicon-glass anodic-bonding and deep etching releasing process provided by Peking University.
提出了一种基于北京大学硅玻璃键合深刻蚀释放工艺的扩展工艺，用来加工微型隧道加速度计。
This accelerometer is fabricated by N type silicon wafer. To obtain high aspect ratio structure, deep reactive ion etching(DRIE) process is employed.
加速度计用普通的N型硅片制造，为了刻蚀高深宽比的结构，使用了深反应离子刻蚀（DRIE）工艺。
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