If this bump is soldered to the pad on a packaging substrate, solder gets wet in the whole region of the columnar bump upper surface and only a part of the side surface.
如果这个块焊接至布线基板上的焊盘，焊料将沾湿于柱状块上表面整个区域，和侧表面的部分区域。
In this technique, the component side of the board is dedicated to the ground plane, and signal traces are placed on the solder side.
采用这种技术时，电路板的元件侧专用于接地层，信号走线则布设在焊接侧。
Solder side is chosen to measure.
量测以吃锡面为选择点。
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