An initiative scheme is given to integrate the spectrometer, imaging system and high sensitivity photodiode array in a three dimension silicon chip.

讨论了实验分光系统、成像系统和高灵敏度探测器列阵混合集成在一块三维硅基片上的初步方案。

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Modulated light is used as detecting signal in this system, photodiode area array is used as receiving module, which greatly improves the sensitivity and anti-interference ability of the system.

系统采取调制光源作为探测信号，采用光敏二极管面阵作为接收组件，大大提高了系统的灵敏度和抗干扰能力。

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We also developed a new low-noise photodiode signal amplification circuit to further improve sensitivity.

同时，已经研制了新的低躁声光电信号放大电路，将用于以后的灵敏度改进。

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