Semiconductor Lead Frame 半导体 ; 半导体导线架
semiconductor lead salt 半导体铅盐
Semiconductor Device-and-Lead Structure Integrated Circuit 半导体Device
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
The automatic cutting system is a special equipment for processing the lead frames of semiconductor ICs after encapsulation.
自动冲切成形系统是半导体集成电路封装引线框架后的加工专用系统。
IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。
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