The conclusion shows that semiconductor cooling effect can only be applied in low heat capacity system or in high pressure closed system.
结论指出，半导体致冷只适用于低热容量系统或高压密封系统。扩大应用范围的唯一途径是研究新型高优质系数的常温致冷材料。
The heat dissipating device comprises at least a soaking unit, at least one semiconductor cooling device and a membrane solar energy battery.
所述散热装置包括至少一个均热单元、至少一个半导体致冷器及一个薄膜型太阳能电池。
The heat exchanger of the structure can effectively raise the semiconductor cooling and warming efficiencies of the semiconductor cold-warm cup seat.
这种结构的热交换装置可以有效提高半导体冷暖水杯座的半导体制冷、制热效能。
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