Heat curable adhesive composition, article, semiconductor apparatus and method.
可热固化粘合剂组合物，制品，半导体器械和方法。
The silicon chip is a main component of the semiconductor apparatus; there is extensive application in printing the integrated circuit and miniature integrated instrument.
硅片是半导体器材的主要元件，在印刷集成电路及微型集成仪表中有着广泛应用。
Semiconductor device, and display device, driving method and electronic apparatus thereof.
半导体器件，显示器件，驱动方法及其电子装置。
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