Through grinding experiments, the grinding performances of resin bond grinding wheels made with self - sharpening diamond (CSD) was studied.

本文通过对比磨削试验，研究了自锐性金刚石(CSD)树脂砂轮的磨削性能。

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Simultaneously, the self-sharpening conditions of the tip on(100) silicon wafers were obtained by the self-sharpening model.

结合自锐效应模型，得到了（100）硅片刻蚀针尖自锐条件。

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Abrasive grain makes up only 30% weight; its self-sharpening action is weaker, resulting in lower grinding efficiency.

磨粒只占总重的30%；其自锐性弱，因而磨削效率很低。

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