Chip Scale Package 封装 ; 芯片级封装 ; 晶片尺寸构装 ; 芯片尺寸封装
wafer level chip scale package 晶圆级封装 ; 晶片级封装
near-chip-scale package 准芯片级封装
Ceramic Chip-Scale Package 陶瓷芯片级封装
stacked chip-scale package 堆栈式CSP封装
CSP Chip Scale Package 芯片等级包
chip scale package csp 芯片尺寸封装
stacked chip scale package 叠层芯片尺寸封装
The device's WLCSP (Wafer Level Chip Scale Package) is ultra compact, simplifying board design.
该器件的WLCSP(晶圆级芯片尺寸封装)是超小型,简化电路板设计。
The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).
该器件提供两种封装:32引脚架构芯片级封装(LFCSP)和25引脚晶圆级芯片规模封装(WLCSP)。
Chip scale package (CSP) for flip-chip on hard substrates and wafer re-distribution is studied, and its process flow is described.
对刚性基板倒装式和晶圆再分布式两种结构的芯片级封装(CSP)进行了研究,描述了CSP的工艺流程;
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