The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).

该器件提供两种封装：32引脚架构芯片级封装（LFCSP）和25引脚晶圆级芯片规模封装（WLCSP）。

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Chip scale package (CSP) for flip-chip on hard substrates and wafer re-distribution is studied, and its process flow is described.

对刚性基板倒装式和晶圆再分布式两种结构的芯片级封装（CSP）进行了研究，描述了CSP的工艺流程；

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The device's WLCSP (Wafer Level Chip Scale Package) is ultra compact, simplifying board design.

该器件的WLCSP(晶圆级芯片尺寸封装)是超小型，简化电路板设计。

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With a recovery package of this scale comes a responsibility to assure every taxpayer that we are being careful with the money they work so hard to earn.

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The team is working with the Swiss Federal Institute of Technology (ETHZ), which has developed a software package for quickly creating large-scale virtual environments in particular cities, in various degrees of detail, called CityEngine.

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