The most established way in semiconductor industry to create such support is the temporary mounting of those materials to rigid carrier substrates.
半导体行业中建造这种支持最公认的方法是临时固定这种衬底材料到刚性载体基底上。
The concept of this technique is given in this paper and the transmissibility for one and two-stage mounting systems supported on rigid foundation is derived systematically.
本文简单叙述了机械阻抗法的概念，系统推证了刚性基础下单级和双级隔振的传递率。
With the increase of the mounting distance of eccentric house, the breaking bending moment increases, while the rigid efficiency increases obviously.
随着偏心体安装孔距的增大破坏弯矩有所增大，连接刚性效率则显著增大。
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