resistance foil clad laminate 覆电阻箔层压板
resistance foil clad laminite 电阻箔复合材料
foil resistance strain gauge 箔阻应变规
foil electrical-resistance strain gauge 箔电阻应变计
resistance strain foil 电阻应变片
This article introduces plane resistor material: LSC-050F type resistance foil clad laminite and its performance, make-up, production process and development background.
论文介绍了平面电阻器新型基材——LSC-050F电阻箔复合材料的性能要求、材料结构、制造工艺以及研制背景。
This article introduces plane resistor material: LSC-050F type resistance foil clad laminate and its performance, make-up, production process and development background.
本文介绍了平面电阻器新型基材-LSC-050F电阻箔复合材料的性能要求、材料结构、制造工艺以及研制背景。
The resistance of the copper rate is low, so in printed circuit board, used to prepare copper foil and double panel, produce multilayer prototypes via metallization copper with on the process.
金属铜的电阻率低，所以在印制电路板中，用来制备铜箔及双面板、多层板的孔金属化方面采用镀铜工艺。
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