A method of joining green state with carbide and silicon carbide was applied to join reaction-bonded silicon carbide (RBSC) ceramics.
以碳化硅和碳为糊料的主要原料，采用素坯连接的方法焊接反应烧结碳化硅(RBSC)陶瓷。
The relationship of technological parameters and microstructure to the resistivity of reaction-bonded silicon carbide(RBSiC) in the presence of liquid silicon was studied in this paper.
研究了液态硅参与下的反应烧结碳化硅的工艺参数、显微组织对其电阻率的影响。
The effects of carbon content, moulding pressure, and carbon particle size of green body on microstructure and properties of reaction-bonded silicon carbide (RBSC) have been investigated.
研究了反应烧结碳化硅陶瓷的显微组织和性能与生坯碳含量、成型压力以及碳粉粒度的关系。
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