有机添加剂对铜互连线脉冲电镀的影响 关键词：铜互连；添加剂；脉冲电镀；粗糙度；极化 [gap=960]Key words：Cu interconnect；additives；pulse electroplating；roughness；polarization
基于20个网页-相关网页
pulse electroplating method 脉冲电镀法
double pulse electroplating 双脉冲电镀
reverse pulse electroplating 双向脉冲电镀
The pulse electroplating parameters were optimized to obtain grain-refined and homogeneous Au film.
通过优化脉冲电镀工艺参数,得到了晶粒细密、平整性良好的镀Au层。
参考来源 - 脉冲电镀法制备AuThis paper optimized the pulse electroplating parameters of Au and Sn in order to obtain fine deposits. Au/Sn dual-layer film was electroplated on Si wafer by pulse electroplating of Au and Sn sequentially.
论文中优化了脉冲镀Au、Sn的工艺参数,得到优良的镀Au层和镀Sn层。
参考来源 - 脉冲电镀法制备Au·2,447,543篇论文数据，部分数据来源于NoteExpress
The theory and application of pulse electroplating.
脉冲电镀的理论与应用。
The rhodium target for Cyclone 30 accelerator is prepared by pulse electroplating method.
研究采用脉冲电镀法制备加速器辐照用铑靶。
Pure nickel deposits were obtained from the traditional Watt nickel plating bath by pulse electroplating.
采用传统的瓦特镀液通过脉冲电镀制得纯镍镀层。
应用推荐