Wafer-Level-Processed Stacked Package 全新的晶圆级堆叠封装
The June 15 date is a wafers-in start date. It can take up to three months for a wafer to be processed and packaged for shipment to customers.
需要注意的是，上面所说的200mm规格产线计划6月15日恢复量产，此日期指的是工厂可以开始接受200mm晶圆片开始加工的日期，而从晶圆片上制出芯片并对其进行封装，制成可以直接销售给客户的成品，则可能需要再等上2.5-3个月。
A number of companies around the world are developing or have begun offering devices processed and packaged in the wafer format.
世界各地的许多公司正在开发或已经开始提供设备加工和包装的晶圆格式。
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