Its comprehensive coverage focuses on printed circuits, integrated circuits, contact materials, semiconductors, wire, bonding, brazing, soldering, and welding.
它的广泛报导集中在印刷电路、集成电路、连接材料、半导体、导线、粘结、钎焊、焊锡和焊接。
This test procedure may apply to any type or combination of current carrying members such as pin and socket contacts, relay contacts, wire and crimp connectors, or printed circuit board and contact.
这个测试程序适用任何类型象针脚,插座,继电器,电线,连接器,印刷电路板等电流通道载体或其结合体。
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