The second substrate includes a power plane deposited at a position of a component mounted to the printed circuit board (PCB) to transmit power to the component.

第二基板包括电力平面，该电力平面安置在组件的被安装到印刷电路板的位置处以向组件传输电力。

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Main materials of printed circuit board (PCB) substrate were macromolecule resins, which were typical viscoelatic materials.

电路板基板材料主要以高分子树脂为主，是典型的黏弹性材料。

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This paper describes the current state and trend of external inspection technology of printed circuit board and mounting substrate.

概述了印制板和安装基板的外观检查技术的现状和动向。

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