... 压敏胶带;pressure sensitive adhesive tape 胶黏片;pressure sensitive adhesive sheet 压敏标签;不干标签;pressure sensitive adhesive label ...
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Expansion extrusion molding, extrusion molding apparatus therefor, and process for producing pressure-sensitive adhesive sheet.
膨胀挤出模塑，采用该法的挤出模塑装置，及用于制备压敏粘合剂片材的方法。
Method of semiconductor wafer back processing, method of substrate back processing, and radiation-curable pressure-sensitive adhesive sheet.
半导体晶圆背面加工方法，衬底背面加工方法，和辐射固化型压敏粘着片。
The adhesive sheet (5) for fixing the flexible printed wiring board (4) to the fixing sheet (6) has a pressure-sensitive layer at least on one side of its porous base.
将柔性印刷电路（4）固定在固定板（6）上的 胶粘剂片（5）在其多孔基材的至少一侧具有压敏胶粘剂层。
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