Copper conductive adhesives were prepared using epoxy as matrix, the mixture ofm-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the con-ducting filler.
以环氧树脂为基体，间苯二胺和氨基二苯甲烷的低融点混合物为固化剂，铜粉为导电填料，制备了热固化各向同性导电胶。
Copper conductive adhesives were prepared using epoxy as matrix, the mixture ofm-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
以环氧树脂为基体，间苯二胺和二氨基二苯甲烷的低融点混合物为固化剂，铜粉为导电填料，制备了热固化各向同性导电胶。
With proper homopolymerized and copolymerized PP as base resins, EPDM as toughener, self-made inorganic filler a as filler, compounds for bumper with desirable properties were prepared.
采用配比合适的均聚和共聚pp为基础树脂，以EPDM为增韧剂，自制无机填充料a为填料制得性能符合要求的保险杠料。
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