Calculations were made of the doped concentration "C0", of the thickness of Cu-film about Cu-treatment and of the junction areas increased by pre-etching.
根据所提出的模型及假设，计算了铜—硫化学比的失配量与掺杂浓度的关系和铜处理工艺中蒸铜层的厚度，采用误差补函数扩散模型计算了结深的增长速率。
The effects of current density on the main properties of iron coating were investigated by using low-temperature iron plating technology without pre-etching.
采用无刻蚀低温镀铁技术，研究电流密度对铁镀层主要性能的影响。
Based on analysis and compare of kinds of iron electroplating methods, a new process of iron electroplating without pre-etching and composite electroplating has been brought forward for restoring.
本项研究是在分析比较现有各种镀铁工艺的基础上，采用了一种新的无刻蚀镀铁及其复合镀工艺。
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