Finally, wire bonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
最后用正交试验的方法对肖特基器件后部封装中的压焊工艺进行了参数优化设计。
The main products are: rectifier diodes, switching diodes, high efficiency diode, trigger diode, Schottky diode, electricity-saving lamps special diode, switching power supply special diode.
主要产品有：各类硅塑封整流二极管、开关二极管、高效率二极管、触发二极管、肖特基二极管、节能灯专用二极管、开关电源专用二极管。
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