The defects, caused reason and remedial actions of polycarbonate PC during CD manufacture are analyzed respectively, which can be guidance to practical manufacture.
分析了光学级聚碳酸酯在光盘生产中的缺陷、产生原因及补救措施。对实际生产具有一定的指导作用。
The mechanical behaviour of polycarbonate (PC) is studied in this paper by tensile experiments. A set of true stress—strain curves for different strain rates is obtained.
本文通过拉伸实验研究了国产聚碳酸酯板的力学行为，得到了这种材料在不同应变速率下的真实应力—应变曲线。
Delamination and cause of polycarbonate (PC) thin-wall component were studied by comprehensive analysis methods and chemical stress cracking mechanism of PC delamination was found.
应用综合分析方法研究了聚碳酸酯(PC)薄壁件分层开裂及其起因，发现了分层的化学应力开裂机制。
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