The sources of iron impurities were investigated and some effective methods were proposed to remove the iron impurities from plating solutions.
分析了铁杂质的来源并提出了几种去除铁杂质的方法。
Properly formulated plating solutions containing the right size particles dispersed in a suitable medium provide low coefficient of surface friction with outstanding wear resistance.
适当配比的镀液，加入拉径正确而又分散于适宜介质内的微粒，可提供表面摩擦系数低、耐磨性优异的镀层。
Summarizes continuous plating processes for electronic connector assemblies including gold, palladium and, tin plating solutions, properties of the films, and continuous plating equipment.
综述了接插件连续镀金、钯、锡的电镀工艺，包括设备、镀液和镀层性质。
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