温度：太部份镀液在室温下操作，如果温度过低则电流效率及电镀范围(plating range)将会减少。如果光泽性不需要 ，则可将镀液温度提升到50℃以提高电镀范围，应用于电铸(electroforming)，印刷电路或印刷板等。
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Do the plating current and program used match the design and traveler? What is the ASF range used during plating? Who determines ASF? How?
电镀电流与程序是否符合设计要求？电镀时的ASF范围是多少？谁确定ASF？如何确认？
Zinc and cobalt content in zinc cobalt alloy plating bath should be maintained in a suitable range so that corrosion resistant zinc cobalt alloy deposit can be obtained.
为获得耐蚀性良好的锌钴合金镀层，必须维持镀液中的锌钴含量在工艺范围内。
Hull cell normally provides information about the performance of a plating process over a wide range of current densities in a single experiment and has a limitation in solution agitation.
赫尔槽实验可以在很宽的电流密度范围内提供电沉积过程的信息，但受到溶液搅拌的限制。
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