... 电镀;electroplating;plating 化学镀镍-磷;Ni-P electroless plating 陶瓷化学镀镍;nickel chemical-plating on ceramics ...
基于1个网页-相关网页
This paper, with orthogonality designing the experiment and finding the parameters through optimizing method as well, mainly discusses the chemical plating technology on the ceramics.
通过正交原理设计试验及优化方法寻找最佳参数，对陶瓷表面化学镀工艺进行了研究。
The results of the experiment indicate that: (1) The combining strength is higher in the chemical plating copper on the ceramics;
结果表明：（1 ）陶瓷化学镀铜结合强度较高，化学镀设备简单，成本低廉；
It was proposed that the reducing agent of electroless plating solution could have some reducing reaction to the grain boundary of PTC ceramics and thus had influence on PTC effect.
提出了化学镀镍溶液中的还原剂对PT C陶瓷的晶界产生还原从而影响PTC效应的观点。
应用推荐