...) 36 5.2 内层导体 37 5.2.1 孔壁与内层铜箔破裂（Plating Crack---Internal Foil) 37 5.2.2 外层铜箔导体破裂（Plating Crack） 38 5.2.3 表层导体厚度（Surface Couductor Thickness- Foil Plus Plating） 39 5.2.4 内层铜箔厚度(Foil Thickness-Internal L...
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crack of plating 镀层裂缝
Plating into a transition (radius transition or undercut) will create a stress concentration that can cause crack initiation.
如果过渡段被电镀(倒角和内切槽)将会产生应力集中，造成裂纹。
Pulse electroplating coating have more powerful hardness and bonding strength than direct current plating, the amounts of crack and porosity are lower than direct current plating.
脉冲镀层硬度和结合力均高于直流镀层，镀层孔隙率、表面裂纹数量和裂纹程度都小于直流镀层。
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