处理版材(Plate materials) 热敏CTP版(thermal CTP processor) 版面尺寸(Material size) 最宽(widest) :1250mm最短(shortest):330mm
基于12个网页-相关网页
thin-plate materials 薄板材料
bipolar plate materials 双极板材料
plate-making for special plate materials 特种印版制版
Processless Printing Plate Materials Technologies 无处理版材技术
plate-type nano-materials 板状纳米材料
High conductivity and gas tightness are the basic requirements for bipolar plate materials.
高电导和气密性是双极板材料需有的基本性能。
Researches on the safety of a hole, drilled eccentricly on round plate materials, are done by using an approximative method.
本文用近似方法对圆板偏心开孔的安全性作了探讨。
This paper presents mainly an outline of the present status of offset printing plate materials in China and their future development trends.
本文主要归纳介绍我国胶印印刷版材目前的概况及今后的发展趋势。
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