... solid reaction process 固相反应法 solid-phase bonding process 固相焊接法 solid-state cementation process 固态置换方法 ...
基于8个网页-相关网页
The scanning electron microscope analyses proves that the bonding mechanism of this process is liquid phase sintering, the change of surface freedom energy is the motivity for sintering.
扫描电镜分析证实，此复合粉末体系的激光烧结是基于液相烧结机制，表面自由能的改变是其烧结的原动力。
The scanning electron microscope analyses proves that the bonding mechanism of this process is liquid phase sintering, the change of surface freedom energy is the motivity for sin…
扫描电镜分析证实，此复合粉末体系的激光烧结是基于液相烧结机制，表面自由能的改变是其烧结的原动力。
Research showed that: during the transient liquid phase diffusion bonding process, there exists a critical value about the choice of the bonding pressure.
研究表明：瞬时液相扩散连接中，压力的施加降低了液相的最大宽度，同时降低了降熔元素的总量，可以减少完成等温凝固所需要的时间。
应用推荐