Because the height of micro tips on cathode surface can be eroded by the negative current, surface finishing is better in the micro-electroforming by periodic reverse pulse current than pulse current.
由于负向电流可以腐蚀削减铸层表面微观突起的生长高度，因此周期换向脉冲电流微电铸与单向正脉冲电流微电铸相比更易获得较好的铸层均匀性。
Properties of coatings obtained by electroplating with pulse current and with periodic reverse direct current are better than that obtained with simple direct current.
脉冲电镀和直流换向电镀在某些方面比直流电镀好，但都有各自的局限性。
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