DOE改善范例DOC55页 DOE改善范例DOC55页 对IC封装业而言，焊线站失铝问题 (Peeling Pad) 对产品良率有著决定性之影向，也是多年来一直无法有效解决之梦靥。
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Use acetone nail polish remover and a fiber-free cosmetic cotton pad to remove oils and debris, which can cause chipping and peeling of nail polish.
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