The peel force of LWB joint is far greater than that of adhesive bonded joint.

激光胶接焊接头的抗剥离力远大于胶接接头的抗剥离力。

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In addition, packaging materials will be degraded by high temperature - reels may soften or warp, and tape peel force may increase.

另外，高温会损坏包装材料——卷轴会软化或弯曲，磁带外壳压力会增大。

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But Dr Bruel found that if a hydrogen-treated wafer is first fused to another wafer that has been given a glass coating, the force of the gas bubbles will instead cause a thin silicon film to peel off the one and on to the other.

ECONOMIST: Chip technology