(1)塑料球栅阵列(PBGA)它采用BT树脂／玻璃层压板作为基板，以塑料（环氧模塑混合物）作为密封材料，焊球为共晶焊料63Sn/37Pb或准共晶焊料62Sn/36Pb/2Ag...
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PBGA（Plastic Ball Grid Array）即通常所的OMPC,是最普通的BGA封装类型。本次模拟过称中采用的是PBGA 14x14 FE64，其热特性如表4-5所示[13]： ...
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HL-PBGA 表面黏着高耐热 ; 表面黏着 ; 轻薄型塑胶球状矩阵封装
FC-PBGA 阵列 ; 封装 ; 构装体 ; 封装的相关基础知识
PBGA Plastic BGA 塑封BGA
PBGA lastic ball grid array 塑胶球形矩阵
PBGA package 塑封球栅平面阵列封装
PBGA A 塑料焊球阵列封装
At the same time, experiments on PBGA solder ball laser reflow were carried out.
同时，本文还对PBGA钎料球激光重熔进行了试验研究。
Research status of laser reflow on solder bump forming of area array packages are introduced, and experimental analysis on laser reflow of PBGA solder ball is performed.
介绍了激光重熔在面阵列封装钎料凸点成形中的研究进展，并且对PBGA共晶钎料球激光重熔进行了工艺研究。
The orthogonal experiment design method was applied to study the relationships between solder joint process parameters and reliability of plastic ball grid array (PBGA) component.
基于正交试验设计法对塑封球栅阵列(PBGA)器件焊点工艺参数与可靠性关系进行了研究。
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