Dry-Film Developing: The unexposed areas of the dry-film are dissolved away. The dry-film creates a "channel"for copper pattern plating to take place.
显影：干膜上未被曝光的部分被显影药水溶解，于是在干膜面上出现沟槽，经过图形电镀将形成“图形”。
Resist: coating material used to mask or to protect selected areas of a pattern from the action of an etchant solder or plating.
阻剂：用来选择性保护某图形区域免受蚀刻剂，焊料或电镀影响的涂层材料。
This paper describes new development of wet plating process in micro fine circuit formation. It can form micro fine circuit pattern on improved performance polyimide film.
概述了在微细线路形成中湿式镀工艺的新开发，可以在改性聚酰亚胺膜上形成微细线路图形。
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