The utility model discloses a multi-chip packaging structure comprising at least a loader, at least a packaging module, an insulation layer and a pattern metal layer.
本实用新型公开一种多芯片封装结构，至少包括一承载器、至少一封装模块、一绝缘层及一图案化金属层。
The pattern metal layer is arranged on the insulation layer and filled into the diversion holes, thereby being an inner linking layer of the multi-chip packaging structure of the utility model.
图案化金属层位于绝缘层上并填入于导通孔中，以作为本实用新型多芯片封装结构的内连线层。
Metal with low carbon level is soft unlike metal that contains much carbon. In forging the two kinds of metal are mixed forming the most beautiful pattern.
和含碳量较高的合金不同，含碳量低的合金稍软一些，在锻造过程中，两种合金熔合在一起，就会形成极其漂亮的花纹。
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