Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste.
回流焊：应用加热金属涂敷层的表面和预涂焊膏，熔融，连接和凝固两个金属涂层。
Take the powder of tin, silver and copper solder as the basis to make solder paste and simulate soldering.
以自制的锡银铜系焊粉为基础制备焊膏并做焊接模拟。
This paper's actual production of lead-free solder paste and lead-free soldering process has been systematically studied.
本文结合公司的生产实际，对无铅锡膏和无铅焊接工艺进行了系统研究。
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