The effects of choosing lapping bevel Angle during testing semiconductor devices and LSI chips by spreading resistance technique on measurement accuracy have been investigated in this paper.
讨论了在检测半导体器件和集成电路芯片时，不同研磨倾斜角度对扩展电阻量值的影响。
Through experiments of high speed lapping with solid abrasives, the effect of lapping pressure on machined surface roughness is studied in this paper.
本文通过实验研究了在固着磨料高速研磨中，研磨压力对工件已加工表面粗糙度的影响。
This paper explains lapping principle and the small tendency mechanism of ball roundness error. It compares the principle, precision and efficiency of several high-precision lapping methods.
本文论述了研磨原理及球体圆度误差趋小化研磨机理；对现有的各种研磨方式的研磨原理、研磨精度、研磨效率等进行了较为全面的比较。
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