Summarizes continuous plating processes for electronic connector assemblies including gold, palladium and, tin plating solutions, properties of the films, and continuous plating equipment.
综述了接插件连续镀金、、的电镀工艺，包括设备、液和镀层性质。
Summarizes continuous plating processes for electronic connector assemblies including gold, palladium and, tin plating solutions, properties of the films, and continuous plating equipment.
综述了接插件连续镀金、钯、锡的电镀工艺，包括设备、镀液和镀层性质。
The invention relates to a chemical plating repairing method for a palladium or palladium alloy composite film.
本发明涉及一种钯或钯合金复合膜的化学镀修补方法。
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