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packaging technology

  • [电子] 封装工艺

网络释义专业释义

  包装技术

技术文摘 关键词:鲜切果蔬，包装材料，包装技术 [gap=850]Key words：fresh-cut;packaging material;packaging technology

基于136个网页-相关网页

  [电子] 封装工艺

新型封装工艺介绍 - 文本浏览模式 - 文档 - 枢研网 关键词：封装工艺；圆片级封装；SiP封装；RCP封装 [gap=714]Key words: packaging technology；wafer package；SiP package；RCP package

基于34个网页-相关网页

  包装工艺学

... 包装工程概论 An introduction to packing engineering 包装工艺学 Packaging technology 包装结构设计 Design of packaging frame ...

基于28个网页-相关网页

短语

Packaging Technology and Equipment 包装技术与设备

Food Packaging technology 食品包装技术

Packaging Technology Management 包装技术管理

WEIFANG W-ANM PACKAGING TECHNOLOGY CO 包装科技有限公司

Packaging Technology Management MSc 包装技术管理理学硕士

Packaging technology equipment 包装技术与设备

Electronic Packaging Technology 电子构装技术 ; 电子封装技术

Packaging Technology Engineer 包装工艺工程师

China Packaging Technology Association 中国包装技术协会

 更多收起网络短语
  • 封装技术 - 引用次数：35

    This demand enormously impels the development of semiconductor IC packaging technology.

    正是这种旺盛的需求极大推动了半导体IC封装技术的发展。

    参考来源 - 反应离子刻蚀在穿透硅通孔封装技术中的应用研究
    封装工艺 - 引用次数：8

    参考来源 - 光栅尺高速高精度跨尺度位移测量方法的研究
    包装工艺学
    组装工艺
  • 封装技术 - 引用次数：11

    参考来源 - 用JavaBean实现对SQL server数据库中图像文件的存取—《电脑知识与技术》—2009年第14期—龙源期刊网
    封装工艺 - 引用次数：4

    Based on the Anisotropic Conductive adhesive Interconnect and Packaging Technology, a set of temperature control system for RFID (radio frequency identification) tag packaging is designed, as well as the PID algorithm experiment.

    本文基于各向异性导电胶互连封装工艺,设计了一套用于RFID(射频识别)电子标签封装的固化模块的温度控制系统,并对温控系统进行了PID算法的闭环控制实验。

    参考来源 - RFID封装中热压模块温度控制系统的设计与实现
  • 组装技术
    封装技术

·2,447,543篇论文数据，部分数据来源于NoteExpress

双语例句权威例句

  • He has taken out a patent on his innovative packaging technology.

    他甚至为了自己独到的包装技术申请了专利。

    youdao

  • In this paper, new progress of electronic packaging technology is presented.

    本文综述了电子封装技术的最新进展。

    youdao

  • As such, from an architectural perspective, OSGi is just a specific packaging technology.

    这样，从一个架构的角度来，OSGi只是一个特殊的封装打包技术。

    youdao

更多双语例句

  • In addition, information tech projection Hitachi flat-screen TV has ever produced (President: Kenichi Yoshitake) is the production technology and techniques such as optical plastic substrate packaging technology developed in the manufacture of flat-screen televisions and other video equipment will continue to contract manufacturing products outside the Hitachi Group.

    ENGADGET: Hitachi to halt domestic production of Wooo LCD and plasma TVs, Mitsubishi to axe optical discs?

  • The upcoming vote pits the newly reconstituted board and turnaround management team at Tessera, a technology development and licensing firm that invented chip-scale packaging (CSP) technology for improved semiconductor performance in the 1990s and is now blazing a trail in advanced semiconductor interconnect technology, against a board takeover attempt by the activist hedge fund Starboard Value LP.

    FORBES: Don't Turn My Company Into A Patent Troll!

  • He said his outfit included the packaging because of the technology--the chemical reaction--not the can.

    FORBES: Gadgets to Go

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