... packaging design 组装设计 packaging technique 组装技术 packed structure 组装（式）结构 ...
基于22个网页-相关网页
Shrinking Packaging Technique 热收缩包装技术
Water Vapour Proof Packaging Technique 防潮包装技术
specific control packaging technique 专用控件封装技术
vacuum packaging technique 真空包装技术
high density packaging technique 高密度组装技术
high-density packaging technique 高密度组装技术
Finally has carried on the study and realization to the change gear case CAD system hypothesized packaging technique.
最后对变速齿轮箱CAD系统中的虚拟装配技术进行了研究和实现。
Low Temperature Co fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multichip modules (MMCM).
低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)的一种理想的组装技术。
Low Temperature Co-fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multi-chip modules (MMCM).
低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)一种理想的组装技术。
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