This post showcases the most unusual and creative packaging designs.
篇文章展现了15款最独特的创意包装设计。
The options provide cost-effective, scalable solutions for complex PCB and IC packaging designs.
该选件为复杂的PCB与IC封装设计提供了可节约成本和可升级的解决方案。
In 3d-mcm (multi chip module) packaging designs, heat dissipation is one of the key issues that must be solved.
在3d - MCM(多芯片组件)封装设计中,大功率和高热流密度导致系统的散热成为关键技术之一。
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